Wafer Fabrication Facility, Confidential
Wafer Fabrication & Scope of Work
- Mercury Engineering were contracted to construct a 12,000m2, class 1 clean room and a fabrication facility to manufacture the latest generation of Chip on 300mm wafers.
Electrical Services: €105,000,000
Mechanical Services: €84,000,000
Fire Protection & Data Services: €17,000,000
A semiconductor material has an electrical conductivity value between a conductor, such as copper, and an insulator, such as glass. Semiconductors are the foundation of modern electronics. The modern understanding of the properties of a semiconductor relies on quantum physics to explain the movement of electrons and holes in a crystal lattice. An increased knowledge of semiconductor materials and fabrication processes has made possible continuing increases in the complexity and speed of microprocessors and memory devices.
Semiconductor device fabrication is the process used to create the integrated circuits that are present in everyday electrical and electronic devices. It is a multiple-step sequence of photo lithographic and chemical processing steps during which electronic circuits are gradually created on a wafer made of pure semiconducting material. Silicon is almost always used, but various compound semiconductors are used for specialized applications.
A typical wafer is made out of extremely pure silicon that is grown into mono-crystalline cylindrical ingots (boules) up to 300 mm (slightly less than 12 inches) in diameter using the Czochralski process. These ingots are then sliced into wafers about 0.75 mm thick and polished to obtain a very regular and flat surface.
“Throughout our dealings with Mercury we have found them to have the necessary resources and commitment to task to undertake complex projects in a safe and efficient manner”
- 19 months