Wafer Fabrication Facility, Confidential Client
Wafer Fabrication & Scope of Work
- Mercury were contracted in the engineering of a 300mm wafer fabrication factory producing 45nm chips spanning a 283,000 m2 area.
- Mercury completed:
- The Streams
- UPV (Ultra Pure Water)
- Instrument Air
- Bulk Chemical and Special Gases services to a fabrication facility with over 20,000 m2 of clean room space.
A semiconductor material has an electrical conductivity value between a conductor, such as copper, and an insulator, such as glass. Semiconductors are the foundation of modern electronics. The modern understanding of the properties of a semiconductor relies on quantum physics to explain the movement of electrons and holes in a crystal lattice. An increased knowledge of semiconductor materials and fabrication processes has made possible continuing increases in the complexity and speed of microprocessors and memory devices.
Semiconductor device fabrication is the process used to create the integrated circuits that are present in everyday electrical and electronic devices. It is a multiple-step sequence of photo lithographic and chemical processing steps during which electronic circuits are gradually created on a wafer made of pure semiconducting material. Silicon is almost always used, but various compound semiconductors are used for specialized applications.
A typical wafer is made out of extremely pure silicon that is grown into mono-crystalline cylindrical ingots (boules) up to 300 mm (slightly less than 12 inches) in diameter using the Czochralski process. These ingots are then sliced into wafers about 0.75 mm thick and polished to obtain a very regular and flat surface.
Kiryat Gat, Israel
- 8 months